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U3900BM-AFNG3

TEMIC SEMICONDUCTORS

TEMIC SEMICONDUCTORS U3900BM-AFNG3
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    R-PDSO-G44
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Telecom IC Type
    TELEPHONE MULTIFUNCTION CIRCUIT
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL EXTENDED
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    44
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    SOP44,.4,32
  • Operating Temperature-Max (Cel)
    75
  • Operating Temperature-Min (Cel)
    -25

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U3900BM-AFNG3
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U3900BM-AFNG3