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U3750BM

TEMIC SEMICONDUCTORS

TEMIC SEMICONDUCTORS U3750BM
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    S-PQCC-J44
  • Package Code
    QCCJ
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • Telecom IC Type
    TELEPHONE MULTIFUNCTION CIRCUIT
  • Make-break Ratio
    1:1.5
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    QUAD
  • Additional Feature
    SELECTABLE MAKE BREAK RATIO 1:2
  • Number of Functions
    1
  • Number of Terminals
    44
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max (Cel)
    55
  • Operating Temperature-Min (Cel)
    -25

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U3750BM
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U3750BM