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TSXPC603RVGB/T8LC

Atmel Corporation

Atmel Corporation TSXPC603RVGB/T8LC
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Bit Size
    32
  • Technology
    CMOS
  • Speed (MHz)
    200
  • JESD-30 Code
    S-CBGA-B255
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    255
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Package Equivalence Code
    BGA255,16X16,50
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR
  • Screening Level / Reference Standard
    MIL-STD-883 Class B (Modified)

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TSXPC603RVGB/T8LC