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TSPC603PVGB/T8LE

THOMSON-CSF COMPSANTS SPECIFIC

THOMSON-CSF COMPSANTS SPECIFIC TSPC603PVGB/T8LE
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.25
  • Bit Size
    32
  • Technology
    CMOS
  • Speed (MHz)
    200
  • JESD-30 Code
    S-PBGA-B255
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    255
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA255,16X16,50
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Operating Temperature-Max (Cel)
    110
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

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TSPC603PVGB/T8LE