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TSPC106AMGB/Q66CE

Atmel Corporation

Atmel Corporation TSPC106AMGB/Q66CE
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    21
  • Length (mm)
    25
  • JESD-30 Code
    R-CBGA-B303
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Address Bus Width
    32
  • Bus Compatibility
    60X; POWERPC 601; POWERPC 603; POWERPC 604
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    BOTTOM
  • Number of Terminals
    303
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    3.16
  • Supply Voltage-Max (V)
    3.465
  • Supply Voltage-Min (V)
    3.135
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    64
  • Package Equivalence Code
    BGA303,19X16,50
  • Clock Frequency-Max (MHz)
    66
  • uPs/uCs/Peripheral ICs Type
    BUS CONTROLLER, PCI
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-STD-883 Class B

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TSPC106AMGB/Q66CE