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TSI721-CED

SILICON360

SILICON360 TSI721-CED
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • JESD-30 Code
    S-CBGA-B
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Bus Compatibility
    I2C
  • Temperature Grade
    MILITARY
  • Terminal Position
    BOTTOM
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Drive Interface Standard
    IEEE 1149.6; IEEE 1149.1
  • uPs/uCs/Peripheral ICs Type
    BUS CONTROLLER, PCI
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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TSI721-CED