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TSI577-10GCLV

Renesas Electronics Corp.

TSI577-10GCLV Datasheet
Renesas Electronics Corp. TSI577-10GCLV
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    21
  • Length (mm)
    21
  • JESD-30 Code
    S-PBGA-B399
  • Package Code
    HBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Telecom IC Type
    TELECOM CIRCUIT
  • Data Rate (Mbps)
    3125
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    399
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2
  • Supply Voltage-Nom (V)
    1.2
  • Package Equivalence Code
    BGA399,20X20,40
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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TSI577-10GCLV
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TSI577-10GCLV