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TSI574-10GILV

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. TSI574-10GILV
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    21
  • Length (mm)
    21
  • JESD-30 Code
    S-CBGA-B399
  • Package Code
    HBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Telecom IC Type
    TELECOM CIRCUIT
  • Terminal Finish
    TIN SILVER COPPER
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    399
  • Terminal Pitch (mm)
    1
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Supply Voltage-Nom (V)
    1.2
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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TSI574-10GILV