ProductsManufacturers
Events
Send an RFQBOM Tool

TSI384-133IL

TUNDRA SEMICONDUCTOR CORP

TUNDRA SEMICONDUCTOR CORP TSI384-133IL
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    17
  • Length (mm)
    17
  • JESD-30 Code
    S-PBGA-B256
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Address Bus Width
    64
  • Bus Compatibility
    PCI
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    256
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.8
  • Supply Voltage-Max (V)
    1.26
  • Supply Voltage-Min (V)
    1.14
  • Supply Voltage-Nom (V)
    1.2
  • External Data Bus Width
    64
  • Drive Interface Standard
    IEEE 1149.6; IEEE 1149.1
  • Clock Frequency-Max (MHz)
    133
  • uPs/uCs/Peripheral ICs Type
    BUS CONTROLLER, PCI
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for TSI384-133IL

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
TSI384-133IL
Send an RFQ
TSI384-133IL