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TSI320-G133CE

TUNDRA SEMICONDUCTOR CORP

TUNDRA SEMICONDUCTOR CORP TSI320-G133CE
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    27
  • Length (mm)
    27
  • JESD-30 Code
    S-PBGA-B352
  • Package Code
    HBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Address Bus Width
    64
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    352
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.4
  • Supply Voltage-Max (V)
    1.32
  • Supply Voltage-Min (V)
    1.08
  • Supply Voltage-Nom (V)
    1.2
  • External Data Bus Width
    64
  • Supply Current-Max (mA)
    0.08
  • Package Equivalence Code
    BGA352,20X20,50
  • Clock Frequency-Max (MHz)
    66
  • uPs/uCs/Peripheral ICs Type
    BUS CONTROLLER, PCI

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TSI320-G133CE
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TSI320-G133CE