TSI107D-133LE by Integrated Device Technology, Inc. | Sourcengine

Integrated Device Technology, Inc. TSI107D-133LE

Lifecycle status
Transferred
Description
FCBGA 33.00x33.00x2.75 mm 1.27mm Pitch
Category
Semiconductors UPs/uCs/Peripheral ICs Multifunction Peripherals MULTIFUNCTION PERIPHERAL

HTS Code
8542.39.00.60
SB Code
8542.39.00.60

Technology
CMOS
Width (mm)
33
Length (mm)
33
JESD-30 Code
S-PBGA-B503
Package Code
BGA
Boundary Scan
YES
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Terminal Finish
TIN LEAD
Address Bus Width
32
Bus Compatibility
I2C, PCI
DLA Qualification
Not Qualified
Terminal Position
BOTTOM
Number of Terminals
503
Terminal Pitch (mm)
1.27
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.75
Supply Voltage-Max (V)
2.625
Supply Voltage-Min (V)
2.375
Supply Voltage-Nom (V)
2.5
External Data Bus Width
64
Package Equivalence Code
BGA503,25X25,50
Clock Frequency-Max (MHz)
66
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
MULTIFUNCTION PERIPHERAL
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
105
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
20