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TSI107D-100JEY

TUNDRA SEMICONDUCTOR CORP

TUNDRA SEMICONDUCTOR CORP TSI107D-100JEY
  • HTS Code
    8542.39.00.60
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • Width (mm)
    33
  • Length (mm)
    33
  • JESD-30 Code
    S-PBGA-B503
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    TIN SILVER COPPER
  • Address Bus Width
    32
  • Bus Compatibility
    I2C, PCI
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    503
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.75
  • Supply Voltage-Max (V)
    2.625
  • Supply Voltage-Min (V)
    2.375
  • Supply Voltage-Nom (V)
    2.5
  • External Data Bus Width
    64
  • Package Equivalence Code
    BGA503,25X25,50
  • Clock Frequency-Max (MHz)
    66
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    MULTIFUNCTION PERIPHERAL
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    0

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TSI107D-100JEY
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TSI107D-100JEY