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TSC80C51XXX-30AG

TEMIC SEMICONDUCTORS

TEMIC SEMICONDUCTORS TSC80C51XXX-30AG
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.15
  • SB Code
    8542.31.00.15
  • Bit Size
    8
  • CPU Family
    8051
  • Technology
    CMOS
  • Speed (MHz)
    30
  • ADC Channels
    NO
  • DAC Channels
    NO
  • DMA Channels
    NO
  • JESD-30 Code
    R-GDIP-T40
  • PWM Channels
    NO
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Address Bus Width
    16
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    DUAL
  • Number of I/O Lines
    32
  • Number of Terminals
    40
  • Program Memory Type
    MROM
  • Terminal Pitch (mm)
    2.54
  • Data RAM Size (bytes)
    128
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    8
  • Supply Current-Max (mA)
    32
  • Package Equivalence Code
    DIP40,.6
  • Clock Frequency-Max (MHz)
    30
  • Program Memory Size (words)
    4096
  • Program Memory Width (bits)
    8
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40

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TSC80C51XXX-30AG
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TSC80C51XXX-30AG