ProductsManufacturers
Events
Send an RFQBOM Tool

TSB80C188EC25

Intel Corporation

Intel Corporation TSB80C188EC25
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.20
  • SB Code
    8542.31.00.20
  • Format
    FIXED POINT
  • Bit Size
    16
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    14
  • RAM (words)
    0
  • Speed (MHz)
    25
  • JESD-30 Code
    S-PQFP-G100
  • Package Code
    LFQFP
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Low Power Mode
    YES
  • Integrated Cache
    NO
  • Address Bus Width
    20
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Additional Feature
    DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
  • Number of Terminals
    100
  • Terminal Pitch (mm)
    0.5
  • Number of Serial I/Os
    2
  • Package Body Material
    PLASTIC/EPOXY
  • Number of DMA Channels
    4
  • On Chip Data RAM Width
    0
  • Seated Height-Max (mm)
    1.7
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    8
  • Supply Current-Max (mA)
    125
  • Clock Frequency-Max (MHz)
    50
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR
  • Number of External Interrupts
    9
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for TSB80C188EC25

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
TSB80C188EC25
Send an RFQ
TSB80C188EC25