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TPA2013D1YZHT

Texas Instruments Incorporated

Texas Instruments Incorporated TPA2013D1YZHT
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Width (mm)
    2.2
  • Length (mm)
    2.2
  • JESD-30 Code
    S-PBGA-B16
  • Package Code
    VFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    TIN SILVER COPPER
  • Consumer IC Type
    CLASS D AUDIO AMPLIFIER
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Channels
    1
  • Number of Functions
    1
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    0.5
  • Output Power-Nom (W)
    2.7
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    0.625
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    1.8
  • Supply Current-Max (mA)
    6
  • Package Equivalence Code
    BGA16,4X4,20
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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TPA2013D1YZHT