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TP66P11(18PDIP)

TENX TECHNOLOGY INC

TENX TECHNOLOGY INC TP66P11(18PDIP)
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • JESD-30 Code
    R-PDIP-T18
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    18
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    DIP18(UNSPEC)
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -5

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TP66P11(18PDIP)
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TP66P11(18PDIP)