TN87C257-200V10

Intel Corporation

Intel Corporation TN87C257-200V10
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • I/O Type
    COMMON
  • Technology
    MOS
  • Width (mm)
    11.43
  • Length (mm)
    13.97
  • JESD-30 Code
    R-PQCC-J32
  • Memory Width
    8
  • Package Code
    QCCJ
  • Package Shape
    RECTANGULAR
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • J-STD-609 Code
    e0
  • Memory IC Type
    OTP ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Memory Organization
    32KX8
  • Number of Functions
    1
  • Number of Terminals
    32
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    200
  • Number of Words Code
    32K
  • Memory Density (bits)
    262144
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    3.55
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    32768
  • Standby Current-Max (A)
    0.0001
  • Supply Current-Max (mA)
    30
  • Package Equivalence Code
    LDCC32,.5X.6
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for TN87C257-200V10

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
TN87C257-200V10
Send an RFQ
TN87C257-200V10