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TMC3200G5A

RAYTHEON SEMICONDUCTOR

RAYTHEON SEMICONDUCTOR TMC3200G5A
  • ECCN
    3A001.A.2.C
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • JESD-30 Code
    S-XPGA-P88
  • Package Code
    PGA
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • Terminal Pitch
    2.54 mm
  • Screening Level
    MIL-STD-883 Class B (Modified)
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    MILITARY
  • Terminal Position
    PERPENDICULAR
  • Number of Terminals
    88
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Package Equivalence Code
    PGA88,13X13
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • uPs/uCs/Peripheral ICs Type
    DSP PERIPHERAL, FLOATING POINT PROCESSOR

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TMC3200G5A
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TMC3200G5A