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TMC216HL1F

RAYTHEON SEMICONDUCTOR

RAYTHEON SEMICONDUCTOR TMC216HL1F
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.60
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • JESD-30 Code
    S-CQFP-F68
  • Package Code
    QFF
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • J-STD-609 Code
    e0
  • Low Power Mode
    YES
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Number of Terminals
    68
  • Terminal Pitch (mm)
    1.27
  • Output Data Bus Width
    32
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    16
  • Package Equivalence Code
    QFL68,.95SQ
  • uPs/uCs/Peripheral ICs Type
    DSP PERIPHERAL, MULTIPLIER
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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TMC216HL1F
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TMC216HL1F