ProductsManufacturers
Events
Send an RFQBOM Tool

TLV2462MU

Texas Instruments Incorporated

Texas Instruments Incorporated TLV2462MU
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Power
    NO
  • Low-Bias
    NO
  • Wideband
    NO
  • Low-Offset
    NO
  • Micropower
    NO
  • Technology
    CMOS
  • Width (mm)
    6.225
  • Length (mm)
    6.475
  • JESD-30 Code
    R-GDFP-F10
  • Package Code
    DFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Amplifier Type
    OPERATIONAL AMPLIFIER
  • Amp Architecture
    VOLTAGE-FEEDBACK
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Programmable Power
    NO
  • Number of Functions
    2
  • Number of Terminals
    10
  • Terminal Pitch (mm)
    1.27
  • Slew Rate-Min (V/us)
    0.9
  • Slew Rate-Nom (V/us)
    1.6
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Frequency Compensation
    YES
  • Seated Height-Max (mm)
    2.03
  • Supply Voltage-Nom (V)
    3
  • Supply Current-Max (mA)
    2
  • Unity Gain BW-Nom (kHz)
    5200
  • Supply Voltage Limit-Max (V)
    6
  • Input Offset Voltage-Max (uV)
    2200
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Bias Current-Max (IIB) @25C (uA)
    0.014
  • Common-mode Reject Ratio-Min (dB)
    66
  • Common-mode Reject Ratio-Nom (dB)
    80
  • Average Bias Current-Max (IIB) (uA)
    0.075

0 suppliers available to buy or to bid for TLV2462MU

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
TLV2462MU
Send an RFQ
TLV2462MU