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TLV2354IPWRG4

Texas Instruments Incorporated

Texas Instruments Incorporated TLV2354IPWRG4
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    4.4
  • Length (mm)
    5
  • Output Type
    OPEN-DRAIN
  • JESD-30 Code
    R-PDSO-G14
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Amplifier Type
    COMPARATOR
  • J-STD-609 Code
    e4
  • Packing Method
    TR
  • Terminal Finish
    NICKEL PALLADIUM GOLD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    4
  • Number of Terminals
    14
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Response Time-Nom (ns)
    640
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Nom (V)
    3
  • Supply Current-Max (mA)
    0.8
  • Package Equivalence Code
    TSSOP14,.25
  • Moisture Sensitivity Level
    1
  • Supply Voltage Limit-Max (V)
    8
  • Input Offset Voltage-Max (uV)
    7000
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Bias Current-Max (IIB) @25C (uA)
    0.002
  • Average Bias Current-Max (IIB) (uA)
    0.002
  • Screening Level / Reference Standard
    TS 16949
  • Time@Peak Reflow Temperature-Max (s)
    30

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TLV2354IPWRG4