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THS7327PHPG4

Texas Instruments Incorporated

THS7327PHPG4 Datasheet
Texas Instruments Incorporated THS7327PHPG4
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Technology
    CMOS
  • Width (mm)
    7
  • Length (mm)
    7
  • JESD-30 Code
    S-PQFP-G48
  • Package Code
    HTFQFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Amplifier Type
    BUFFER
  • J-STD-609 Code
    e4
  • Terminal Finish
    NICKEL PALLADIUM GOLD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Number of Functions
    1
  • Number of Terminals
    48
  • Terminal Pitch (mm)
    0.5
  • Slew Rate-Nom (V/us)
    1050
  • Package Body Material
    PLASTIC/EPOXY
  • Output Current-Min (A)
    0.045
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Nom (V)
    3.3
  • Bandwidth (3dB)-Nom (MHz)
    500
  • Moisture Sensitivity Level
    3
  • Supply Voltage Limit-Max (V)
    5.5
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Average Bias Current-Max (IIB) (uA)
    3.5
  • Time@Peak Reflow Temperature-Max (s)
    30

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THS7327PHPG4