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TDC-GP30YD1K

SCIOSENSE BV

SCIOSENSE BV TDC-GP30YD1K
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    5
  • Length (mm)
    5
  • JESD-30 Code
    S-PQCC-N32
  • Package Code
    HVQCCN
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Terminal Position
    QUAD
  • Number of Terminals
    32
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.5
  • Supply Voltage-Nom (V)
    3
  • Package Equivalence Code
    LCC32,.2SQ,20
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40

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TDC-GP30YD1K