ProductsManufacturers
Events
Send an RFQBOM Tool

TDA8922TH

PHILIPS SEMICONDUCTORS

PHILIPS SEMICONDUCTORS TDA8922TH
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • JESD-30 Code
    R-PDSO-G24
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Consumer IC Type
    AUDIO AMPLIFIER
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    2
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Current-Max (mA)
    75
  • Package Equivalence Code
    SOP24,.56,40
  • Peak Reflow Temperature (Cel)
    245
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for TDA8922TH

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
TDA8922TH
Send an RFQ
TDA8922TH