ProductsManufacturers
Events
Send an RFQBOM Tool

TDA8261TW

PHILIPS SEMICONDUCTORS

PHILIPS SEMICONDUCTORS TDA8261TW
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    R-PDSO-G32
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Consumer IC Type
    CONSUMER CIRCUIT
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Number of Terminals
    32
  • Terminal Pitch (mm)
    0.635
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    TSSOP32,.3
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -20

0 suppliers available to buy or to bid for TDA8261TW

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
TDA8261TW
Send an RFQ
TDA8261TW