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TDA8024TT

PHILIPS SEMICONDUCTORS

PHILIPS SEMICONDUCTORS TDA8024TT
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • JESD-30 Code
    R-PDSO-G28
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Number of Terminals
    28
  • Terminal Pitch (mm)
    0.635
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    TSSOP28,.25
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -25

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TDA8024TT
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TDA8024TT