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TDA8006H/C2

PHILIPS SEMICONDUCTORS

PHILIPS SEMICONDUCTORS TDA8006H/C2
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • JESD-30 Code
    R-PQFP-G64
  • Package Code
    QFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    QUAD
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    QFP64,.7X.95,40
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -25

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TDA8006H/C2
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TDA8006H/C2