TDA4VM88T5BALFRQ1
Texas Instruments Incorporated
- Lifecycle statusDiscontinued
- RoHSRoHS compliant
- REACHREACH compliant
- DescriptionSoC, CMOS, PBGA827
- Category
- HTS Code8542.31.00.01
- SB Code8542.31.00.70
- TechnologyCMOS
- Width (mm)24
- Length (mm)24
- JESD-30 CodeS-PBGA-B827
- Package CodeFBGA
- Package ShapeSQUARE
- Package StyleGRID ARRAY, FINE PITCH Meter
- Surface MountYES
- Terminal FormBALL
- J-STD-609 Codee1
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- Terminal PositionBOTTOM
- Number of Terminals827
- Terminal Pitch (mm)0.8
- Package Body MaterialPLASTIC/EPOXY
- Seated Height-Max (mm)2.8
- Supply Voltage-Max (V)0.84
- Supply Voltage-Min (V)0.76
- Supply Voltage-Nom (V)0.8
- Package Equivalence CodeBGA827,29X29,32
- Moisture Sensitivity Level3
- uPs/uCs/Peripheral ICs TypeSoC
- Peak Reflow Temperature (Cel)250
- Operating Temperature-Max (Cel)125
- Operating Temperature-Min (Cel)-40
- Screening Level / Reference StandardAEC-Q100
- Time@Peak Reflow Temperature-Max (s)30
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