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TDA2HABDQAASRQ1

Texas Instruments Incorporated

Texas Instruments Incorporated TDA2HABDQAASRQ1
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Format
    FLOATING POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    17
  • Length (mm)
    17
  • Speed (MHz)
    500
  • JESD-30 Code
    S-PBGA-B625
  • Package Code
    FBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Low Power Mode
    YES
  • Terminal Finish
    TIN SILVER COPPER
  • Integrated Cache
    NO
  • Address Bus Width
    16
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    BOTTOM
  • Number of Terminals
    625
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.95
  • Supply Voltage-Max (V)
    1.2
  • Supply Voltage-Min (V)
    1.11
  • Supply Voltage-Nom (V)
    1.15
  • External Data Bus Width
    32
  • Clock Frequency-Max (MHz)
    38.4
  • Moisture Sensitivity Level
    4
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Peak Reflow Temperature (Cel)
    250
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    AEC-Q100
  • Time@Peak Reflow Temperature-Max (s)
    30

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