TDA2EGADQABCRQ1
Texas Instruments Incorporated
- Lifecycle statusActive
- RoHSRoHS compliant
- REACHREACH compliant
- DescriptionSoC, CMOS, PBGA760
- Category
- ECCN5A992.C
- ECCN GovernanceEAR
- HTS Code8542.31.00.50
- SB Code8542.31.00.70
- TechnologyCMOS
- Width (mm)23
- Length (mm)23
- JESD-30 CodeS-PBGA-B760
- Package CodeFBGA
- Package ShapeSQUARE
- Package StyleGRID ARRAY, FINE PITCH Meter
- Surface MountYES
- Terminal FormBALL
- J-STD-609 Codee1
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- Temperature GradeAUTOMOTIVE
- Terminal PositionBOTTOM
- Number of Terminals760
- Terminal Pitch (mm)0.8
- Package Body MaterialPLASTIC/EPOXY
- Seated Height-Max (mm)2.96
- Supply Voltage-Max (V)1.2
- Supply Voltage-Min (V)1.11
- Supply Voltage-Nom (V)1.15
- Moisture Sensitivity Level3
- uPs/uCs/Peripheral ICs TypeSoC
- Peak Reflow Temperature (Cel)250
- Operating Temperature-Max (Cel)125
- Operating Temperature-Min (Cel)-40
- Screening Level / Reference StandardAEC-Q100
- Time@Peak Reflow Temperature-Max (s)30
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