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TC835CBU

TELCOM SEMICONDUCTOR INC

TELCOM SEMICONDUCTOR INC TC835CBU
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.30
  • Technology
    CMOS
  • JESD-30 Code
    S-PQFP-G64
  • Package Code
    QFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Converter Type
    ADC, DUAL-SLOPE
  • J-STD-609 Code
    e0
  • Number of Bits
    17
  • Output Bit Code
    BINARY CODED DECIMAL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Number of Functions
    1
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    3
  • Package Equivalence Code
    QFP64,.66SQ,32
  • Analog Input Voltage-Max (V)
    2
  • Linearity Error-Max (EL) (%)
    0.0008
  • Number of Analog In Channels
    1
  • Negative Supply Voltage-Nom (V)
    -5
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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TC835CBU
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TC835CBU