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TBP38R16X-20FN

Texas Instruments Incorporated

Texas Instruments Incorporated TBP38R16X-20FN
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    TTL
  • JESD-30 Code
    S-PQCC-J28
  • Memory Width
    8
  • Organization
    2KX8
  • Package Code
    QCCJ
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • Memory Density
    16384 bit
  • Memory IC Type
    OTP ROM
  • Terminal Pitch
    1.27 mm
  • Number of Words
    2048 words
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Number of Terminals
    28
  • Number of Words Code
    2K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    LDCC28,.5SQ
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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TBP38R16X-20FN