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TBP24SA10MJ

Texas Instruments Incorporated

Texas Instruments Incorporated TBP24SA10MJ
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    7.62 mm
  • Length
    19.56 mm
  • Technology
    BIPOLAR
  • JESD-30 Code
    R-GDIP-T16
  • Memory Width
    4
  • Organization
    256X4
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    1024 bit
  • Memory IC Type
    OTP ROM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    75 ns
  • Number of Words
    256 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    5.08 mm
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Supply Current-Max
    100 mA
  • Number of Functions
    1
  • Number of Terminals
    16
  • Number of Words Code
    256
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Package Equivalence Code
    DIP16,.3
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Supply Voltage-Nom (Vsup)
    5 V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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TBP24SA10MJ