ProductsManufacturers
Events
Send an RFQBOM Tool

STP2220ABGA-83

SUN MICROSYSTEMS INC

SUN MICROSYSTEMS INC STP2220ABGA-83
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    35
  • Length (mm)
    35
  • JESD-30 Code
    S-PBGA-B327
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    327
  • Terminal Pitch (mm)
    1.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.68
  • Supply Voltage-Max (V)
    3.45
  • Supply Voltage-Min (V)
    3.15
  • Supply Voltage-Nom (V)
    3.3
  • Package Equivalence Code
    BGA372,20X20
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for STP2220ABGA-83

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
STP2220ABGA-83
Send an RFQ
STP2220ABGA-83