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STP2202ABGA

SUN MICROSYSTEMS INC

SUN MICROSYSTEMS INC STP2202ABGA
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    35
  • Length (mm)
    35
  • JESD-30 Code
    S-PBGA-B320
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    320
  • Terminal Pitch (mm)
    1.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.68
  • Supply Voltage-Max (V)
    3.465
  • Supply Voltage-Min (V)
    3.135
  • Supply Voltage-Nom (V)
    3.3
  • Supply Current-Max (mA)
    758
  • Package Equivalence Code
    BGA320,20X20
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Operating Temperature-Max (Cel)
    70

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STP2202ABGA