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STP2200ABGA-100

SUN MICROSYSTEMS INC

SUN MICROSYSTEMS INC STP2200ABGA-100
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    27
  • Length (mm)
    27
  • JESD-30 Code
    S-PBGA-B225
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Low Power Mode
    NO
  • Number of Banks
    4
  • Terminal Finish
    TIN LEAD
  • Address Bus Width
    35
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Memory Organization
    256M X 8
  • Number of Terminals
    225
  • Terminal Pitch (mm)
    1.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.48
  • Supply Voltage-Max (V)
    3.45
  • Supply Voltage-Min (V)
    3.15
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    1
  • Supply Current-Max (mA)
    758
  • Package Equivalence Code
    BGA225,15X15
  • uPs/uCs/Peripheral ICs Type
    MEMORY CONTROLLER, DRAM

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STP2200ABGA-100
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STP2200ABGA-100