ProductsManufacturers
Events
Send an RFQBOM Tool

STP1100BGA-100

SUN MICROSYSTEMS INC

SUN MICROSYSTEMS INC STP1100BGA-100
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Format
    FLOATING POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    27
  • Length (mm)
    27
  • RAM (words)
    0
  • Speed (MHz)
    100
  • JESD-30 Code
    S-PBGA-B272
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Integrated Cache
    YES
  • Address Bus Width
    32
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL EXTENDED
  • Terminal Position
    BOTTOM
  • Number of Terminals
    272
  • Terminal Pitch (mm)
    1.27
  • Number of Serial I/Os
    0
  • Package Body Material
    PLASTIC/EPOXY
  • Number of DMA Channels
    0
  • On Chip Data RAM Width
    0
  • Seated Height-Max (mm)
    2.54
  • Supply Voltage-Max (V)
    3.47
  • Supply Voltage-Min (V)
    3.14
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    32
  • Package Equivalence Code
    BGA272,20X20,50
  • Clock Frequency-Max (MHz)
    33.33
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Number of External Interrupts
    15
  • Operating Temperature-Max (Cel)
    80
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for STP1100BGA-100

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
STP1100BGA-100
Send an RFQ
STP1100BGA-100