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SSTVF16859DGG

PHILIPS SEMICONDUCTORS

PHILIPS SEMICONDUCTORS SSTVF16859DGG
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    R-PDSO-G64
  • Package Code
    TSSOP
  • Logic IC Type
    D FLIP-FLOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    2.5
  • Package Equivalence Code
    TSSOP64,.32,20
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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SSTVF16859DGG