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SSTV16857EC

PHILIPS SEMICONDUCTORS

PHILIPS SEMICONDUCTORS SSTV16857EC
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    R-PBGA-B56
  • Package Code
    FBGA
  • Logic IC Type
    D FLIP-FLOP
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    56
  • Terminal Pitch (mm)
    0.635
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    2.5
  • Package Equivalence Code
    BGA56,6X10,25
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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SSTV16857EC
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SSTV16857EC