Advanced Micro Devices, Inc. (AMD) SSS747M
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Width
    6.35 mm
  • Length
    6.1595 mm
  • Low-Offset
    NO
  • Technology
    BIPOLAR
  • Architecture
    VOLTAGE-FEEDBACK
  • JESD-30 Code
    R-CDFP-F14
  • Package Code
    DFP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Amplifier Type
    OPERATIONAL AMPLIFIER
  • Terminal Pitch
    1.27 mm
  • Screening Level
    MIL-STD-883 Class C
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Seated Height-Max
    2.032 mm
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Functions
    2
  • Number of Terminals
    14
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Frequency Compensation
    YES
  • Input Offset Voltage-Max
    3000 uV
  • Package Equivalence Code
    FL14,.3
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Nom (Vsup)
    15 V
  • Common-mode Reject Ratio-Nom
    80 dB
  • Neg Supply Voltage-Nom (Vsup)
    -15 V
  • Average Bias Current-Max (IIB)
    0.1 uA

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SSS747M
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SSS747M