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SSI73K221-22IC

SILICON SYSTEMS INC

SILICON SYSTEMS INC SSI73K221-22IC
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • JESD-30 Code
    R-XDIP-T22
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Telecom IC Type
    MODEM
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    22
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    CERAMIC
  • Supply Current-Max (mA)
    25
  • Package Equivalence Code
    DIP22,.4
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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SSI73K221-22IC
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SSI73K221-22IC