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SS9FD04GH3BAIS01

Smart Modular Technologies, Inc.

Smart Modular Technologies, Inc. SS9FD04GH3BAIS01
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    SLC NAND TYPE
  • Width
    36.4 mm
  • Length
    42.8 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-XUUC-N50
  • Memory Width
    8
  • Organization
    4GX8
  • Package Code
    DIE
  • Package Shape
    RECTANGULAR
  • Package Style
    UNCASED CHIP Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory Density
    34359738368 bit
  • Memory IC Type
    FLASH CARD
  • Operating Mode
    ASYNCHRONOUS
  • Number of Words
    4294967296 words
  • Seated Height-Max
    3.3 mm
  • Terminal Position
    UNSPECIFIED
  • Additional Feature
    ALSO OPERTAES WITH 5V NOMINAL SUPPLY
  • Supply Current-Max
    200 mA
  • Number of Functions
    1
  • Number of Terminals
    50
  • Programming Voltage
    3.3 V
  • Standby Current-Max
    0.004 Amp
  • Number of Words Code
    4G
  • Package Body Material
    UNSPECIFIED
  • Data Retention Time-Min
    10
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.465 V
  • Supply Voltage-Min (Vsup)
    3.135 V
  • Supply Voltage-Nom (Vsup)
    3.3 V

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SS9FD04GH3BAIS01