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SPI1027ML351816SEU

Smart Modular Technologies, Inc.

Smart Modular Technologies, Inc. SPI1027ML351816SEU
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Technology
    CMOS
  • JESD-30 Code
    R-XDMA-N244
  • Memory Width
    72
  • Package Code
    DIMM
  • Self Refresh
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory IC Type
    DDR3L DRAM MODULE
  • Operating Mode
    SYNCHRONOUS
  • Number of Ports
    1
  • Terminal Position
    DUAL
  • Memory Organization
    1GX72
  • Number of Functions
    1
  • Number of Terminals
    244
  • Number of Words Code
    1G
  • Memory Density (bits)
    77309411328
  • Package Body Material
    UNSPECIFIED
  • Supply Voltage-Nom (V)
    1.35
  • Number of Words (words)
    1073741824
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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SPI1027ML351816SEU
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SPI1027ML351816SEU