ProductsManufacturers
Events
Send an RFQBOM Tool

SPAK56F827FG80

Motorola,Inc.

Motorola,Inc. SPAK56F827FG80
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.35
  • SB Code
    8542.31.00.35
  • Format
    FIXED POINT
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    20
  • JESD-30 Code
    R-PQFP-G128
  • Package Code
    LFQFP
  • Boundary Scan
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Barrel Shifter
    YES
  • Low Power Mode
    YES
  • Address Bus Width
    16
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Additional Feature
    ALSO REQUIRES 3.3V SUPPLY
  • Number of Terminals
    128
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.6
  • Supply Voltage-Max (V)
    2.75
  • Supply Voltage-Min (V)
    2.25
  • Supply Voltage-Nom (V)
    2.5
  • External Data Bus Width
    16
  • Clock Frequency-Max (MHz)
    80
  • Internal Bus Architecture
    MULTIPLE
  • uPs/uCs/Peripheral ICs Type
    DIGITAL SIGNAL PROCESSOR, CONTROLLER
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for SPAK56F827FG80

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
SPAK56F827FG80
Send an RFQ
SPAK56F827FG80