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SP8043DG1

Sipex Corporation

SP8043DG1 Datasheet
Sipex Corporation SP8043DG1
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    BICMOS
  • Width (mm)
    5.2
  • Length (mm)
    6.6
  • JESD-30 Code
    R-PBGA-B16
  • Package Code
    TFLGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BUTT
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Interface IC Type
    INTERFACE CIRCUIT
  • Temperature Grade
    COMMERCIAL EXTENDED
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.1
  • Moisture Sensitivity Level
    4
  • Peak Reflow Temperature (Cel)
    240
  • Operating Temperature-Max (Cel)
    80
  • Operating Temperature-Min (Cel)
    -30

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SP8043DG1
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SP8043DG1