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SP1660/DG

GEC PLESSEY SEMICONDUCTORS

GEC PLESSEY SEMICONDUCTORS SP1660/DG
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    ECL
  • JESD-30 Code
    R-XDIP-T16
  • Package Code
    DIP
  • Logic IC Type
    OR/NOR GATE
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Schmitt Trigger
    NO
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    CERAMIC
  • Supply Current-Max (mA)
    28
  • Package Equivalence Code
    DIP16,.3
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -30
  • Propagation Delay-Max@Nom-Sup (ns)
    2.3

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SP1660/DG
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SP1660/DG