Texas Instruments Incorporated SN74LVC1G38DBVRG4
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width
    1.6 mm
  • Family
    LVC/LCX/Z
  • Length
    2.9 mm
  • Max I(ol)
    32 Amp
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G5
  • Package Code
    LSSOP
  • JESD-609 Code
    e4
  • Logic IC Type
    NAND GATE
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Packing Method
    TR
  • Terminal Pitch
    0.95 mm
  • Schmitt Trigger
    NO
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Number of Inputs
    2
  • Seated Height-Max
    1.45 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    5
  • Prop. Delay@Nom-Sup
    4.5 ns
  • Qualification Status
    Not Qualified
  • Load Capacitance (CL)
    50 pF
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    OPEN-DRAIN
  • Propagation Delay (tpd)
    10 ns
  • Package Equivalence Code
    TSOP5/6,.11,37
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    1.65 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    260
  • Power Supply Current-Max (ICC)
    0.01 mA
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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SN74LVC1G38DBVRG4