SN74LVC1G34DCKRQ1 by Texas Instruments Incorporated | Sourcengine

Texas Instruments Incorporated SN74LVC1G34DCKRQ1

Lifecycle status
Active
RoHS
RoHS compliant
REACH
REACH compliant
Description
Buffer 1-CH Non-Inverting Push-Pull T/R Automotive AEC-Q100
Category
Semiconductors Logic ICs Gates BUFFER

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.39.00.90
SB Code
8542.39.00.60

Family
LVC/LCX/Z
Technology
CMOS
Width (mm)
1.25
Length (mm)
2
JESD-30 Code
R-PDSO-G5
Package Code
TSSOP
Logic IC Type
BUFFER
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Packing Method
TR, 7 INCH
Schmitt Trigger
NO
Terminal Finish
Tin (Sn)
Number of Inputs
1
Terminal Position
DUAL
Number of Functions
1
Number of Terminals
5
Terminal Pitch (mm)
0.65
Load Capacitance (pF)
50
Package Body Material
PLASTIC/EPOXY
Propagation Delay (ns)
9.9
Seated Height-Max (mm)
1.1
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
1.65
Supply Voltage-Nom (V)
3.3
Supply Current-Max (mA)
0.01
Package Equivalence Code
TSSOP5/6,.08
Moisture Sensitivity Level
1
Output Low Current-Max (mA)
32
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-40
Propagation Delay-Max@Nom-Sup (ns)
4.7
Screening Level / Reference Standard
AEC-Q100
Time@Peak Reflow Temperature-Max (s)
30