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SN74LS213JP4

Texas Instruments Incorporated

Texas Instruments Incorporated SN74LS213JP4
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    TTL
  • JESD-30 Code
    R-XDIP-T20
  • Memory Width
    12
  • Organization
    16X12
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    2.54 mm
  • Number of Words
    16 words
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    20
  • Number of Words Code
    16
  • Package Body Material
    CERAMIC
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIP20,.3
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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SN74LS213JP4
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SN74LS213JP4