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SN74AUP1G34YEPR

Texas Instruments Incorporated

Texas Instruments Incorporated SN74AUP1G34YEPR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Family
    AUP/ULP/V
  • Technology
    CMOS
  • Width (mm)
    0.9
  • Length (mm)
    1.4
  • JESD-30 Code
    R-XBGA-B5
  • Package Code
    VFBGA
  • Logic IC Type
    BUFFER
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Packing Method
    TR
  • Schmitt Trigger
    NO
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    5
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    UNSPECIFIED
  • Seated Height-Max (mm)
    0.5
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    0.8
  • Supply Voltage-Nom (V)
    3.3
  • Package Equivalence Code
    BGA5,2X3,20
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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